FLASHBOND™ UV

Epoxybond UV-5608DC is a light-activated adhesive with delayed cure that will allow for alignments and adjustments before full bonding strength is achieved.

Known as "delayed cure epoxy adhesive" this ground-breaking, photo-sensitive chemistry allows for fast processing and bonding of parts, even if both parts are opaque.

What is a Delayed Cure Epoxy Adhesive?

UV-Activated Delayed Cure Epoxy Adhesives display a delayed cure, which allows for production line operators and prototypers to manage adjustments in alignment before the curing cycle is completed. The adhesive is applied and irradiated with long wave UV light to initiate the cycle, but it will not promptly achieve full bonding strength.

Also kown as Light-Curable Delayed Action Epoxy Adhesives, this type of chemistry requires irradiation with long wave UV light (typically between 325nm-380nm.) Then, depending upon the formulation, UV intensity, and duration, the surface skin cure and subsequent all-through cure will be delayed by seconds or minutes. This allows two opaque parts that are not permeable to the visual spectrum to be glued together using a UV adhesive.

What does Multimarket have to offer?

UV-5608DC is one of a series of epoxy adhesives that can be activated by exposure to a 405nm light source with an intensity of about 150mW/cm2 for 5-10 seconds. Parts are mated together and aligned within 45-60 seconds of activation. The adhesive will yield green strength after 30 minutes for handling. Full cure will occur over the next 16 hours at room temperature. If desired, cure can also be accomplished with UV energy or higher intensity blue light for a full cure in under 10 seconds. Variations with alternative dwell and cure times and/or viscosities are available.

Delayed cure epoxy UV-5608DC will bond to metals, ceramic, glass, ABS, Polycarbonates, Ultem and other engineered plastics. This medium viscosity epoxy produces a high strength bond with low cure shrinkage and a glass transition temperature of over 80°C. UV-5608DC, for instance, can withstand temperature cycling from of -40°C to 120°C. The cured product exhibits excellent thermal, water and chemical resistance.

UV-5608DC requires no mixing, reducing processing time and errors. reduced water absorption, no foul odors, and no oxygen inhibition. This innovative delay cure epoxy adhesive can be used in any industry. Typical applications include bonding of optical components, optical alignment, fibers, lenses, prisms and other electronic components where low shrinkage and low outgassing are required. It is ideal for ferrite core bonding, magnetics and general assembly.