Epoxy Potting for Motors & Stators

Robust performance from a variety of solutions.

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Our line of epoxy potting and encapsulating compounds for motors and stators are in use by motor manufacturers worldwide, to encapsulate thousands of stators every day.


 Our suite of products varies in physical and handling properties, to allow manufacturers to choose the right system for their application. Still, design engineers and product managers can expect all our systems to be formulated for robust performance.

Here's what to expect from our Epoxy Compounds for Motors & Sators:

  • Low viscosity allowing systems to penetrate and release air from even the tightest coil and slot windings, enabling our customers to eliminate varnishing and VPI practices from their process.
  • Excellent thermal conductivity, allowing for heat dissipation away from motors and coil winding.
  • Special formulation to withstand temperature ranges from -60°C up to 180°C (UL 1446, class H rating)

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What does Multimarket have to offer?

EC-1850FT is a liquid-dispensed filled epoxy system offering excellent heat transfer, high voltage insulation, low exothermic and minimum shrinkage. It is a lower viscosity version of EC-1850FT-LV. It rapidly transfers heat, eliminates hot spot, and increases the operating efficiency of most encapsulated devices. Its low shrinkage minimizes risk of damage to fragile components. It is useful for potting and encapsulating densely packaged power supplies and heat generating components, integrated circuits, power and operational amplifiers, transformers and many types of semiconductors.


EC-1015 is a low viscosity liquid-dispensed epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.


EC-1012M is a pourable, flame retardant, filled epoxy resin system featuring high thermal conductivity, good electrical insulation and low shrinkage during cure. It is useful for potting and encapsulating components or modules, when removal of heat and resistance to mechanical and thermal shock are prime considerations. Typical Applications include potting or encapsulating densely packaged power supplies, integrated circuits, small transformers, capacitors bushings etc.


EC-1015LV-RT is a low viscosity filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It offers the excellent heat transfer, high voltage insulation and dimensional stability over a wide temperature range. As an encapsulant for power devices it distributes heat evenly throughout the casting, providing greater efficiency and longer working life. It is useful for potting and encapsulating densely packaged power supplies, integrated circuits, thick film hybrid devices, D/A converters, oscillators, amplifiers, relays, transformers and semiconductors etc


Available through Multimarket, these and other products are offered in bulk containers for automated production, and in easy to use dual cartridges for production by hand and for prototyping purposes. Easy to use, there is no need to weigh or mix the epoxy by hand. Do get in touch for pricing and availability.


Product Viscosity (cPs) Pot Life W/mK Service Temperature Hardness
EC-1015 3,000-5,000 >8 hrs 1.2 -55°C-180°C D-92
EC-1015LV-RT 2,000-3,000 1-2 hrs 1.4 -55°C-130°C D-92
EC-1850FT 50,000-60,000 40-60 min 1.5 -55°C-120°C D-90
EC-1850FT-LV 4,000-8,000 40-60 min 1.5 -55°C-120°C D-90
EC-1012M 3,000-6,000 4-5 hrs 0.9 -55°C-160°C D-91

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